Sep 20 – 24, 2021
US/Pacific timezone

Thermal core usage challenges in Android

Sep 22, 2021, 8:35 AM
Microconference3/Virtual-Room (LPC Virtual)


LPC Virtual

Android MC Android MC


Wei Wang (Google LLC)


The Android community has been using thermal core infrastructure for both Tj and Tskin solutions for years, and many thermal DVFS features from various Vendors/OEMs are built upon this, which usually require changes in the thermal governor and framework. However, with GKI introduced, it is now forbidden for OEM to put a custom thermal governor as a module which limits the solution and sometimes leads to sub-optimal code which combines an in-driver governor. In addition, there are many learnings from use of the thermal core infrastructure for both Tskin and Tj solutions together, especially on the way they interact with each other. This talk will describe those problems in more detail and discuss potential solutions and improvements to the current situation.

I agree to abide by the anti-harassment policy I agree

Primary author

Wei Wang (Google LLC)

Presentation materials

Diamond Sponsor

Platinum Sponsor

Gold Sponsors

Silver Sponsors

Speaker Gift Sponsor

T-Shirt Sponsor

Conference Services provided by